The semiconductor industry has always faced challenges caused by device scaling, architecture evolution, and process complexity and integration. These challenges are coupled with a need to provide new ...
The optimized component made of glass fiber-reinforced polyamide is represented here within the NX program with a weight-optimized lattice structure. Photo Credit, all images: Naddcon AIM3D GmbH ...
Turn photos into 3D with Meta's SAM 3D, using SAM 2 masks and Gaussian splatting, so you can build assets quickly for ...
Modern semiconductor processes are extremely complicated and involve thousands of interacting individual process steps. During the development of these process steps, roadblocks and barriers are often ...
The speed of light has come to 3D printing. Northwestern University engineers have developed a new method that uses light to improve 3D printing speed and precision while also, in combination with a ...
Classification society ABS said it is working with Israel Shipyards to approve the shipbuilder's 3D models as part of plan review of its 45-meter multi-mission Offshore Patrol Vessel (OPV). “Israel ...
At TU Wien, researchers are developing three-dimensional (3D) printing techniques that can be used to create living ...
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