A collaborative team has achieved the first monolithic 3D chip built in a U.S. foundry, delivering the densest 3D chip wiring ...

Varanasi: Also known as Banaras and Kashi, Varanasi received the ‘Smart City Innovation Award-2025' for its unique 3D Urban ...

Abstract: Direct Transfer Bonding (DTB) is a promising technology for die-to-wafer bonding in 3D/heterogeneous integration, addressing limitations of conventional direct/hybrid bonding (DB/HB) methods ...

MakeGood, Inc. has unveiled its innovative 3D-Printed Toddler Mobility Trainer to enhance mobility for young children with ...

Campbell's Soup Company faced a sudden market shock after a leaked audio recording allegedly captured a senior executive ...

Campbell’s is insisting that its soups aren’t made with 3D-printed chicken, lab-grown chicken, or bioengineered meat. The ...

Meta Releases SAM 3 and SAM 3D AI Models In two separate blog posts, the Menlo Park-based tech giant detailed the new AI models. There are three models in total. SAM 3 for image and video tracking and ...

Abstract: Interposer technology is essential for electrical connections between dies and components. Among silicon, glass, and re-distribution layer (RDL) interposers, RDL offers improved signal ...