Catching all defects in chip packaging is becoming more difficult, requiring a mix of electrical tests, metrology screening, and various types of inspection. And the more critical the application for ...
A technical paper titled “Improved Defect Detection and Classification Method for Advanced IC Nodes by Using Slicing Aided Hyper Inference with Refinement Strategy” was published by researchers at ...
image: THE INTRODUCTION OF DEFECTS INTO ELECTRODE MATERIALS FOR METAL-BASED BATTERIES IS AN EFFECTIVE STRATEGY TO IMPROVE BATTERY PERFORMANCE, DUE TO DEFECTIVE CATALYSTS HAVE THE ADVANTAGES OF HIGH ...
A recent review article published in Advanced Materials explored the potential of artificial intelligence (AI) and machine learning (ML) in transforming thermoelectric (TE) materials design. The ...
An international research team led by NYU Tandon School of Engineering and KAIST (Korea Advanced Institute of Science and Technology) has pioneered a new technique to identify and characterize ...
Applied Materials has launched the SEMVision™ H20, a new defect review system designed to enhance the analysis of nanoscale defects in advanced semiconductor chips. This system utilizes cutting-edge ...
With the move to advanced process technologies, concerns over device power once largely limited to specialized markets have escalated rapidly among mainstream designers. More semiconductor companies ...
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