Abstract: The floorplan of chiplets in heterogeneously integrated systems-in-package (SiPs) must consider multiphysics (electrical, thermal, and mechanical) performance and meet positional constraints ...
COMSOL Multiphysics version 6.4 accelerates engineering simulations and multiphysics models. Full GPU support across all ...
Abstract: As integrated circuits continue to downscale and current density in interconnects increases, electromigration (EM) concerns have gained significant attention. In this study, we present an EM ...
COMSOL Multiphysics software lets you model just about anything from electromagnetic fields to structural mechanics and chemical reactions. While many of its capabilities fall outside the interest to ...
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