The new high-performance modules deliver up to 180 TOPS of power-efficient computation designed for next-level AI ...
Just yesterday, we wrote about the Qualcomm Dragonwing Q‑7790 and Q‑8750 AIoT SoCs, and on the same day, Quectel launched the ...
Asia’s best solutions provider, today announces the introduction of NVIDIA Jetson T4000 edge AI module, addressing the ...
ADLINK Technology has launched what it says is the first COM Express module to use Intel Core Ultra Series 3 processors.
Press Trust of India on MSN
Innodisk Corporation: Innodisk Unveils the New "AI on Dragonwing" Computing Series with the First EXMP-Q911 COM-HPC Mini Module Powered by Qualcomm's S…
The module integrates a high-efficiency AI SoC with in-house software and peripherals to serve as a powerful Edge AI platform ...
Chip designer MediaTek is realigning priorities by diverting its engineering and research muscle toward AI-focused custom ...
Today James takes a look at the latest Phanteks Enthoo Pro ii case - not their first dual system case, but their best yet. We ...
InWin unveils its latest Signature Series case called AEON, and it's almost a meter tall, and features polished stainless ...
OT data is accessed from such components as Festo valve manifolds, servo drives, energy efficiency modules and remote I/O.
At CES 2026, they will launch a Zone Controller Development Kit—a modular design for Zone Control Units (ZCU) engineered to ...
Infineon Technologies AG and Flex are collaborating on the development of software-defined vehicles (SDVs) at CES 2026 in the form of a zone controller development kit.
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