COMSOL Multiphysics version 6.4 accelerates engineering simulations and multiphysics models. Full GPU support across all ...

The latest version of the multiphysics simulation software introduces GPU acceleration through NVIDIA's CUDA® direct sparse solver, the Granular Flow Module and time-explicit structural dynamic ...

Multiphysics simulation helps engineers understand the interaction of thermal, structural, acoustic, fluid, and electromagnetic effects in complex systems. Accurate material properties are crucial; ...

It’s surprising to learn that the idea of 3D integrated circuits (3D ICs) has been kicking around for over sixty years. Not long after the first MOS IC emerged in 1960, researchers were already ...

Many technologies rely on electric discharge phenomena, including consumer electronics, medical devices, and high-voltage power systems. During product development, it is highly beneficial to simulate ...

COMSOL Multiphysics is a comprehensive simulation software platform that enables engineers and scientists to model and analyze multidisciplinary physical systems. By integrating multiple fields of ...

The high power consumption of electronic systems, driven by applications in Artificial Intelligence (AI) and High-Performance Computing (HPC), is generating a significant demand to address overheating ...

Contractors can predict the potential outcome of a concrete casting process by using the maturity method, but it can be difficult to apply this technique in the field. This is why Heidelberg Materials ...

The latest version of the multiphysics simulation software introduces the Electric Discharge Module, GPU-accelerated simulations and updates for greater modelling productivity. Image 1: Pressure ...

BURLINGTON, Mass., Nov. 19, 2024 (GLOBE NEWSWIRE) -- COMSOL, a global leader in modeling and simulation software, today announced the release of COMSOL Multiphysics® version 6.3, which delivers new ...

3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, ...