Delivering high HDR performance and low power consumption for next-generation automotive cameras ATSUGI, Japan, Oct. 28, 2025 /PRNewswire/ -- Sony Semiconductor Solutions Corporation (Sony) today ...

MIPI SWI3S v1.0 provides a flexible, multi-drop interface between audio peripherals and the host processor with unified control and data to meet the challenges of embedded audio systems MIPI SWI3S ...

MIPI SWI3S v1.0 provides a flexible, multi-drop interface between audio peripherals and the host processor with unified control and data to meet the challenges of embedded audio systems Consumer ...

The MIPI Alliance, the international organisation that develops specifications that standardise wired interfaces for mobile and other connected ecosystems, has released a new audio specification. New ...

BRIDGEWATER, N.J., Oct. 16, 2025 – The MIPI Alliance, an international organization that develops specifications that standardize wired interfaces for mobile and other connected ecosystems, today ...

The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, announced the release of MIPI I3C Basic v1.2, a scalable utility ...

The MIPI Alliance, an international organisation that develops interface specifications for mobile and mobile-influenced industries, has released MIPI I3C Basic v1.2. MIPI Alliance releases I3C Basic ...

The MIPI Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced the release of MIPI I3C Basic v1.2, a scalable ...

MIPI I3C reduces energy consumption to transfer 1 kB by about 5× to 18× compared with legacy I2C. MIPI I3C supports options for higher-performance, high-data-rate modes that can provide speeds in ...

Teledyne FLIR, part of Teledyne Technologies, announced the expansion of the Boson+ thermal camera module product line with 24 compact models featuring 320 x 256 resolution. Radiometry, the ability to ...