Abstract: This paper combines an experimental and modeling approach to investigate the thermal aspects of backside power delivery network configurations. A dedicated test chip with integrated thermal ...
Abstract: In this work, we will show experimental data of high-speed MZM PIC in module level at 100G/ch and simulated data of SOH-MZM at 200G/ch to prove this SOH-PIC technology is capable for 200G/ch ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results
Feedback