This solution accelerator provides a unified data foundation with integrated data architecture leveraging Microsoft Fabric, OneLake, Microsoft Purview, and Azure Databricks to deliver a unified, ...
Abstract: 2.5D/3D stacked heterogeneous integration packages, like CoWoS (Chip on Wafer on Substrate) technology, are increasingly adopted in high-performance computing (HPC) for data centers and AI ...
Abstract: Processing-using-DRAM (PUD) is a processing-in-memory (PIM) approach that uses a DRAM array's massive internal parallelism to execute very-wide (e.g., 16,384-262,144-bit-wide) data-parallel ...
The proliferation of artificial intelligence workloads is creating concern about the ability of data center networks to keep up with demand. One part of the solution is co-packaged optics (CPO), which ...
Extract data and apply schemas across your multi-modal content, with confidence scoring and user validation enabling greater speed of data ingestion. Process claims, invoices, contracts and other ...
The PlayStation 5 is one of the most powerful gaming consoles available, delivering stunning graphics, fast load times, and immersive gameplay. However, even the PS5 ...
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