India Semiconductor Push 2025: 122 Chip Designs Taped Out, 28 Student Chips Handed Over Under C2S Programme at SCL Mohali ...

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Tata Electronics and the Centre for Development of Advanced Computing (C-DAC), under the Ministry of Electronics and Information Technology (MeitY), signed a Memorandum of Understanding (MoU) to ...

Arteris, Inc., a provider of system IP for semiconductor development, announced an expansion of its multi-die solution to support chiplet-based designs. The solution addresses the increasing ...

At the 2025 TSMC North America Open Innovation Platform (OIP) Ecosystem Forum, Siemens Digital Industries Software announced new collaborations with TSMC to support the foundry’s latest process ...

AMI has announced that it is bringing its expertise in industry-leading silicon firmware solutions to the Arm Total Design ecosystem, aimed at accelerating development of custom silicon on Arm Compute ...

STMicroelectronics announced a new microcontroller series with improved embedded artificial intelligence (AI) capability by integrating, for the first time, accelerated machine-learning (ML) ...

Samsung held a tool-in ceremony for its new semiconductor research and development complex (NRD-K) at its Giheung campus, marking a significant leap into the future. About 100 guests, including those ...

Samsung Electronics has begun mass production of its one-terabit (Tb) quad-level cell (QLC) 9th-generation vertical NAND (V-NAND). With the industry’s first mass production of QLC 9th-generation ...

Toshiba announces the Mx11 family of helium-sealed high-capacity HDDs. The Mx11 family includes the MG11 Series, which provides capacities of up to 24TB using conventional magnetic recording (CMR), ...

5G RedCap was finalized in the 3GPP’s Release 17 to provide device OEMs with a migration pathway from 4G LTE to 5G for mid-range devices, whose throughput requirements sit between those of enhanced ...